Singapore's Leading Precision manufacturing equipment manufacturer and a Singapore-based clean energy company focused on high‑precision manufacturing site producing micro‑connectivity solutions.

• Operate wire bonding machines (ball bond / wedge bond) for semiconductor device assembly
• Set up bonding parameters such as temperature, force, ultrasonic power, and bonding time
• Perform machine conversion, recipe setup, and product changeover
• Inspect wire bonds using microscope to ensure bond quality and reliability
• Conduct pull test and shear test to verify bonding strength and compliance with specifications
• Troubleshoot bonding defects such as non‑stick on pad (NSOP), wire sweep, lifts, and cratering

• Able to work on wirebond equipments
• Possess relevant experience in manufacturing line