Perform cross‑section analysis and Scanning Electron Microscopy (SEM) inspection to monitor process health and ensure production quality.
Handle Transmission Electron Microscopy (TEM) sample preparation using Focus Ion Beam (FIB) for detailed TEM inspection.
Identify defects and failure mechanisms through physical failure analysis using a variety of sample de‑processing techniques and a wide range of failure analysis equipment.
Complete physical fault isolation techniques to pinpoint and resolve issues that may impact production efficiency.
Collaborate with engineering teams to provide timely feedback and implement solutions to maintain efficient production tool performance.
Support the analysis of wafers with functional failures by applying various Failure Analysis tools and techniques to isolate defects and identify root causes.
Preserve comprehensive documentation of analytical findings and approac...