Responsibilities

• Be responsible for Die Prep equipment day to day line sustaining, PM and conversion.
• Able to hands on and provide systematic problem analysis.
• Ability to troubleshoot, analyze complex problems and 5 WHY analysis.
• Be available for overtime work as of when needed.
• Experience in PM and major down troubleshooting.
• Responsible to liaise with process engineering team for low yield triggering.

Qualifications

• Certificate / Diploma in Electrical & Electronic / Mechatronic or Equivalent.
• 1~3 years of equipment engineering experience in Wafer soft test equipment maintenance.

Preferred

• Knowledge in Backgrind, wafer saw and Taping will be added advantage.
• Die Prep equipment maintenance and troubleshooting skill, wafer handling skill and involve in some improvement project.

Skills

• Able to do troubleshooting and mainten...