The Technical Solution Manager (TSM) for Ball Bonder (BB) and Wedge Bonder (WB) will provide customer-facing technical leadership to support business growth and customer success across Southeast Asia and India.

This role collaborates closely with Sales, Engineering, Service, and Product Management teams to deliver optimal bonding solutions, facilitate customer evaluations and production ramp-ups, and act as a vital conduit for customer feedback to global stakeholders.

Responsibilities

• Serve as the primary technical contact for BB and WB customers, supporting both pre-sales and post-sales initiatives.
• Offer expert consultation on ball bonding and wedge bonding processes, bonder configuration, application solutions.
• Support customer evaluations, qualifications, and benchmarking for BB and WB platforms.
• Work in partnership with Sales teams on RFQs, customer visits, technical presentations, and opportunity developm...