The Die Attach /Clip Attach (Solder) Engineer own, develop, and sustain the solder die attach & clip attach process to achieve stable yields, high equipment uptime, and full compliance to reliability and customer requirements. The role demands wide semiconductor manufacturing experience across high‑mix assembly, rigorous process controls, and data‑driven problem solving to support both NPI ramp and high‑volume manufacturing.

ØProcess Ownership & Control •Define, sustain and optimize key die attach parameters and tooling effectiveness. •Establish and maintain the recipe management system, process/set-up controls, process capability, process performance (Ppk). •Generates and maintain PFMEA, Control Plan, Work Instruction (WI), One Point Lesson (OPL), reaction plans (OCAP) ØYield & Quality Improvement •Lead problem solving using 8 Discipline for internal and external issues such as customer complaints (EFAR). •Knowledgeable in DMAIC approach for continuous improvement project...