Position Overview
Job Description
Qualify, Assembly Sustenance and Process Improvements on Power QFN package and Cu Clip related thin die assembly processes.
Key Responsibilities
Design package, develop processes to qualify PQFN (Power Quad Flat-No lead) packages for SPS (Smart Power Stage) products & its associated modules.Ramp up manufacturing volume and qualify required sources.Responsible for line sustaining. Improve assembly yield, capacity, quality and costs.Address internal and external customer feedback / issues collaborating with Test / Product Engineers, Quality & Operations organization.Manage Product Lifecycle Management documents to the latest status.Conduct change-management with suppliers to sustain / improve capacity and cost. Qualifications
Degree in Mechanical, Material, Physics, Chemistry or Applied Sciences.Experienced in process engineering or package development of material/proce...