. Perform electromagnetic extractions on interconnects in IC Packages and PCBs, using tools such as Ansys HFSS, Q3D, SIWave, etc., . Perform signal integrity circuit simulations on parallel digital interfaces such as DDR, analog SerDes channels and Power Delivery Networks (PDN), using tools such as ADS, Ansys Designer or HSpice. . Work closely with IC Package Design engineers for electrical design optimization of Packaging Interconnects and PDN . Work closely with IP owners, chip leads, package and PCB design engineers to optimize Bump/Ball maps of IPs and SoCs and to verify that the package electrical performance meets intended system impact targets . Perform frequency and time domain lab measurements on silicon die, bare substrates, PCBs and systems, often using micro probe stations . Contribute to the documentation of the simulation / extraction flows and Design Guidelines . Interface with substrate and assembly suppliers through the packaging team, to help drive packaging technolog...