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Qualcomm Packaging group is responsible for developing new package technologies and high-volume manufacturing deployment for different product segments for mobile market & new emerging markets for AI, IoT, Automotive. This team is responsible for roadmap, working with OSATs, IC substrate suppliers, internal design and product teams as well as NPI. Team is looking for experienced packaging substrate engineer who has worked on substrate technologies.

This IC package substrate engineering role will focus on 2D/2.5D based chiplet technology development and next-generation substrate technologies used in advanced semiconductor packaging. The role requires IC substrate fine patterning, small via, new material knowledge and data analysis skill set.

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