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Staff Engineer, Packaging Engineering

Sandisk
Location 📍 Bengaluru, India
Posted 📅 June 04, 2026
Work Type ⏰ full-time

Position Overview

Job Description

Our Package Design Engineering team is seeking a talented Staff Engineer with expertise in thermal management, based at our Bangalore site. In this role, you will be pivotal in driving innovation in thermal design for our high-performance flash products, as well as developing and maintaining advanced simulation tools. 

ESSENTIAL DUTIES AND RESPONSIBILITIES:

  • Work in the Packaging R&D group on thermal designs across semiconductor packaging level, flash product printed circuited board assembly (PCBA) level, and host level.
  • Innovate thermal management solutions for high-performance flash products 
  • Enhance and maintain our modeling and simulation infrastructure to improve efficiency and accuracy across the design and manufacturing processes.
  • This position may interface with package & product design, electrical, thermal and physical characterization, reliability testing, failure analysis, assembly R&a...

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Job Details

Employment Type
full-time
📊
Category
Engineers
🏠
Work Arrangement
On-site
📍
Location
Bengaluru, India