We are actively driving advanced package technology and developing power package with focusing on next generation technologies for AI data center and automotive. To achieve the rapidly growing demand and expedite release to market of power packages, we are developing such as Power QFN, HSON, HSOT and TOLL. This role offers the opportunity to work on higher density, lower resistance, higher reliability, and high thermal dissipation package design and develop technologies.

Key Responsibilities

• Design and develop power package and interconnect for Renesas’s packaging needs in the areas of power QFN, HSON, HSOT and TOLL for AI data center and Automotive.
• Work with OSAT/Internal manufacturing especially collaboration with Malaysia and Japan PKG team to develop, run DOE to optimize processes and establish process specification.
• Work with Product groups and QA team to define target of package structure/design, develop new package and processes...