The application window is expected to close on: 06/30/2026
**Job posting may be removed earlier if the position is filled or if a sufficient number of applications are received** .

**Meet the Team**

As Hardware Test & Packaging Engineer, you will help develop and support Cisco’s next generation component and packaging platform for Cisco's Silicon Photonics Integrated Circuits and chipsets. As a member of the platform team (engineering), you’ll be responsible for improving and supporting high-volume, automated optical assembly and test processes.

**Your Impact**

Design, Develop and Support

+ Work as part of platform team that develops tools and components for high-volume manufacturing to support, debug and improve tools and processes
+ Analyze data from Cisco’s automated packaging tools/processes to shape new projects targeting improvements in Cisco-designed high-volume manufacturing platforms
+ Recommend and implement test/assembly/...