At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology.
This position involves defining and leading the development of advanced packaging and 3DIC analysis flows for foundry and customer solutions.


Location/s; remote role but must be located in the US.


The candidate will have expert knowledge of the Cadence toolset and/or equivalent competitor toolsets in the context of multiple flows including high-speed signal design, power design, signal integrity, power integrity and definition of electrical constraints. Design experience and industry knowledge of one of Signal, Power, and Thermal analysis associated with IC, package, or PCB design is required .

The candidate needs to have the ability to analyze the customer's environment and evaluate appropriate solutions. Be knowledgeable and aware of competitive technologies. Anticipates technical issues and develops creative solutions before they be...