**Job Details:**

**Job Description:**

Intel Foundry is seeking a highly experienced IC Packaging Design Manager to lead the delivery of advanced packaging solutions within the Advanced Design and Customer Engineering (ADCE) organization. You will lead a team responsible for driving package design execution to ensure first-pass success across customer programs. In this role, you will act as a trusted technical partner to customers, enabling successful adoption of Intel's advanced packaging technologies (EMIB, Foveros, chiplet architectures). This position requires technical depth, and leadership across all aspects of advanced packaging design.

**Key Responsibilities:**

+ **Leadership and Management**
+ Lead and manage a group of IC Packaging Engineers, providing guidance, mentorship, and support to ensure the successful execution of projects.
+ Oversee the planning, scheduling, and execution of package design projects, ensuring that milestones ...