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Silicon Packaging Design Engineer

Intel
Location 📍 Hillsboro, United States
Posted 📅 June 06, 2026
Work Type ⏰ Full-time

Position Overview

**Job Details:**

**Job Description:**

Intel seeks a motivated and innovative Silicon Packaging Design Engineer to join our team, driving the end-to-end development of silicon interposer and bridge designs that define the future of computing and connectivity. As a key contributor to Intel's cutting-edge technology, you will play a pivotal role in bridging silicon and hardware design, optimizing package performance, and delivering high-impact solutions that meet performance, cost, and manufacturability goals. Your expertise will directly contribute to Intel's mission to create world-changing technology that improves lives and connects communities worldwide.

**Key Responsibilities:**

- Design and implement physical layout and routing of silicon interposers and embedded bridges.
- Perform substrate fit and routing studies to evaluate design tradeoffs in performance, cost, and manufacturability.
- Collaborate closely with silicon, technology develop...

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Job Details

Employment Type
Full-time
📊
Category
other-general
🏠
Work Arrangement
On-site
📍
Location
Hillsboro, United States