Summary

onsemi is currently seeking a hands‑on Assembly Process Engineer to join our External Manufacturing team with a focus on wire bond processes, preferably with experience in gold to copper wire conversion. In this role, you will leverage your strong expertise in leading cost savings initiative across multiple subcons. This position will report to External Manufacturing Operation Manager and is based in the ONKL office, Selangor.

Key Duties and Responsibilities

• Experience in developing, implementing & optimizing wire bonding processes for NPI & production devices to achieve yield & quality metric.
• Experience in DOE methodology & tools (Minitab, JMP) to ensure wire bond process robustness & reliability.
• Good problem‑solving skills, able to identify & resolve wire bonding problems/defects, perform root cause analysis & implement robust corrective actions.
• Manage change control processes & documentation, including risk as...