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⏰ Full-time

Senior Wire Bond Equipment & Process Engineer

Nexperia
Location 📍 Seremban, Malaysia
Posted 📅 May 28, 2026
Work Type ⏰ Full-time

Position Overview

We are seeking a Senior Wire Bond Equipment & Process Engineer to join our dynamic team. In this role, you will leverage your expertise in wire bonding technology to optimize semiconductor manufacturing processes and ensure the highest quality and reliability in production. You will work closely with cross-functional teams, including R&D, process engineering, and manufacturing, to drive continuous improvement and innovation.
 

What You Will Do:

  • Lead the setup, qualification, and optimization/CZ/DOE of wire bonding equipment and processes.

  • Develop and implement process improvements to enhance yield, reliability, and throughput.

  • Troubleshoot, Disposition and resolve equipment and process issues in a fast-paced production environment.

  • Collaborate with design, quality, and manufacturing teams to support new product introductions.

  • Analyze process data to identify trends and implement corrective ...

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    Job Details

    Employment Type
    Full-time
    📊
    Category
    Engineers
    🏠
    Work Arrangement
    On-site
    📍
    Location
    Seremban, Malaysia