onsemi is seeking a Wire Bond Process Engineer to optimize the thermosonic wire bond process for ensuring quality and reliability. The ideal candidate will have a Bachelor's degree in Engineering and at least 3 years of semiconductor manufacturing experience, with hands-on work on K&S, ASM, or Shinkawa UTC platforms. This role involves managing process capabilities, leading continuous improvement initiatives, and ensuring compliance with quality standards. Ideal candidates possess strong analytical skills and knowledge of bond metallurgy.
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