Responsibilities

• Engage semiconductor customers to understand packaging roadmap, process requirements, throughput targets, yield and reliability challenges.
• Support technical sales activities and customer discussions.
• Benchmark competitor equipment and identify technology gaps.
• Translate customer requirements into internal equipment specifications.
• Develop and optimize TCB process parameters on TCB Equipments.
• Support advanced packaging applications including HBM, CoWoS, CoPoS, 2.5D Packaging, 3D Packaging and Chiplet Integration.
• Troubleshoot bonding issues such as non-wet, misalignment, voids, delamination and warpage.
• Conduct DOE and process characterization activities.
• Work closely with Mechanical, Software, Electrical, Motion and Vision teams.
• Define alignment accuracy, thermal performance, bond force profiles, throughput targets and process windows.
• Lead machi...