Be the driver of Package Technology DFMEA.

Job Description

In your new role, you will:

• Be the owner of Risk Interaction assessment and mitigation work packages.
• Integrate unit processes (BOM and Process) in the package platform - Risk assessment, study interaction with other processes, process flow.
• Work closely with FE in FE/BE interaction and integration topics.
• Support pre-development activities for new chip technology.
• Lead or participate in 8D/problem-solving for interaction issues.
• Provide technical guidance and assistance in projects related to interaction topics.

Your Profile

You are best suited for this role if you have:

• Bachelor’s Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics Physics).
• Preferably 5 years of experience in the IC/semiconductor industry.
• Knowledge of semiconductor pac...