The candidate will be part of the Far-Backend of Line (Far-BEOL) process module team, advancing specialty microelectronics technologies at IME. His/Her main roles and responsibilities include:
Develop Chip-to-Wafer (C2W) bonding process capabilities using fusion, hybrid, thermocompression, and eutectic bonding for photonics heterogeneous integration and advanced packaging applications.
Lead module loop integration for layer transfer of III-V and other compound materials through C2W bonding and post-processing.
Drive innovations in process methodologies, materials, and approaches, and generate intellectual property related to heterogeneous integration platforms.
Collaborate with industry partners to align on and develop the building blocks required for next-generation heterogeneous integration platforms, including equipment capabilities.