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Senior Product Engineer (Pkg PE MFG), Heterogeneous Integration Group(HIG), High Bandwidth Mem[...]

Micron Technology
Location 📍 singapore, Singapore
Posted 📅 June 04, 2026
Work Type ⏰ Full-time

Position Overview

Our Vision

We transform how the world uses information to enrich life for all. We are passionate about innovation for customers and partners and commit to integrity, sustainability, and giving back to our communities.

Position Overview

As a member of HIG HBM Package Product Engineering, you will lead and develop a high‑performing team driving Package and HBM Product engineering activities within the HBM Systems and Product Engineering Team. You will be part of a global team of Product Engineers leading a portfolio of best‑in‑class next‑generation HBM products focused on key KPIs: quality, cost, cycle time, and scale.

Key Responsibilities

  • Asset and yield improvement: improve assembly coverage to reduce Time‑0 and Field DPM and prevent inline fallout.
  • HBM cube yield improvement: optimize test coverage with Technology Development and Packaging to reduce manufacturing line yield.
  • Cumulative yield ownership: lead ...

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Job Details

Employment Type
Full-time
📊
Category
Business Engineering & Management
🏠
Work Arrangement
On-site
📍
Location
singapore, Singapore