Your mission

The future of AI computing is light. Q.ANT is building photonic processing systems that compute with light – delivering a scalable, energy-efficient alternative to transistor-based architectures for next-generation AI and HPC applications.

As Senior Photonics Packaging Engineer (f/m/d), you will lead the specification, development, and verification of high-density photonic packaging solutions that integrate photonic integrated circuits (PICs), light sources, photodetectors, and analog circuitry into production-ready modules. You'll be the technical authority ensuring that supplier-delivered modules meet stringent optical, electrical, thermal, and mechanical requirements through precise definition of technical requirements, contractual agreements, and supplier project management.