Our Newport based client is currently searching for a Senior Packaging Process Engineer to work within a challenging R&D environment to explore and develop disruptive semiconductor packaging and integration technologies. The role will involve leading a team of engineers to develop new microelectronic devices with novel new packaging concepts including assembly, wire-bonding and die bonding. Prototype development will be an important part of the role.

Required skills for the Senior Packaging Process Engineer will include:

Strong semiconductor packaging and assembly experience

Semiconductor device knowledge

Strong communication and leadership skills

Degree qualified in Physics, Electronics, Engineering or equivalent

Please contact Rachel Anderson for further details.