My client is looking for a Senior Packaging Process Engineer, to be an expert in leading microelectronics assembly and validation, specialising in advanced packaging technologies. The Senior Packaging Process Engineer will work on advanced AI infrastructure, co-packaged RF architectures, and photonic systems.

This is an onsite position based in Wales.

Responsibilities

• Develop advanced packaging assembly processes including 2.5D and 3D integration
• Design and validate high-speed interconnect solutions for system-in-package platforms
• Define interconnect schemes including flip chip, wafer‑level packaging and hybrid bonding
• Lead design‑for‑manufacturing activities with internal and external teams
• Run DOEs, reliability testing, failure analysis and process control
• Work with suppliers, partners and customers to evaluate materials and equipment
• Support lab‑based activities including process characterisation...