Join us in an outstanding opportunity as a Senior Package Modeling Engineer in the Advanced Technology Group (ATG) at NVIDIA. Using our history of innovation, you will contribute to the next era of computing, driven by AI and pioneering technology. As part of our team, your efforts will directly affect the reliability and performance of advanced semiconductor package developments. This role is ideal for someone who is highly motivated and committed to achieving flawless results in a cooperative environment.
What You'll Be Doing:
+ Conduct Finite Element Analysis (FEA) to assess stress, warpage, and thermo-mechanical behavior throughout advanced semiconductor packaging platforms.
+ Contribute to packaging technology direction and long‑term roadmaps by evaluating new materials, interconnect concepts, and process options with a focus on structural robustness and reliability.
+ Analyze material properties and their impact on package reliability.
+ Establish modeling approach...