To perform qualification on semi-conductor packaging equipment through verification of machine calibration, setup and process bonding on semiconductor packaging equipment.
Identify, diagnose and resolve assembly process related problems to achieve defined first pass yield and manufacturing cycle-time.
Develop and qualify manufacturing inspection protocols (metrology equipment qualification or integrity test definition) for manufacturing usage.
Recommend enhancements to process recipes, process tooling or manufacturing processes to ensure excellent manufacturing process coverage of semiconductors packaging equipment to their bonding functionalities.
Establish PFMEA process testing for customized kits to ensure machine is performing to customer’s requirements.
Ensure and validate all necessary fixtures, jigs, drawings, and work instruction are available for manufacturing processes.