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Senior Molding Equipment Engineer — Lead HVM & Yield

Nexperia
Location 📍 seremban, Malaysia
Posted 📅 June 18, 2026
Work Type ⏰ Full-time

Position Overview

Nexperia is a world-class company in semiconductor development and in-house production. A proven global player with an entrepreneurial mentality. At our core is an 13,000+ strong international network with a singular focus. Built on passion and commitment to our work, belief in our goals and a drive to succeed regardless of the challenges we face. We support, reward and challenge individuals equally, in a dynamic and energetic environment.

About The Role

As a Senior Engineer (Molding) , you will be responsible for ensuring the reliability, performance, and continuous improvement of molding equipment in a high-volume semiconductor manufacturing environment. This role plays a critical part in supporting new product introductions, driving yield and uptime improvements, and enabling advanced packaging technologies. You will work closely with cross-functional teams including Process Engineering, R&D, NPI, and Product Design.

What You Will Do

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Job Details

Employment Type
Full-time
📊
Category
Engineering
🏠
Work Arrangement
On-site
📍
Location
seremban, Malaysia