The advanced Packaging Program at the Institute of Microelectronics (IME) is seeking a passionate and skilled Scientist or Senior Scientist to join our team. This role is pivotal in advancing the state-of-the-art advanced packaging platform technologies, such as 2.5D/3D IC and Co-packaged optics. Development of critical modules includes fine pitch multi-layer redistribution layers (RDL), micro bumping, Temporary bonding and debonding process flow, flip chip thermal compression bonding, chip-to-wafer and wafer-to-wafer fusion/hybrid bonding capabilities, developing fan-out wafer level packaging, 2.5D interposer, and 3D chip stacking process integration flows for Heterogeneous Integration of chiplets.

The position provides an exciting opportunity to contribute to groundbreaking technologies and collaborate with a dynamic team of researchers and external ecosystem stakeholders

Key Responsibilities: