Axiado Corporation is seeking a Senior IC Packaging Engineer to provide technical leadership and architectural ownership of advanced IC and System-in-package(SiP) in a fast-growing startup environment. This role is designed for a senior technologist who combines deep hands-on expertise with system-level thinking, and who thrives in high-ambiguity, high-impact settings.

You will define and drive high-performance, low-power packaging architectures spanning 2D and RDL based fan-out (2.5D), chiplet-based designs, and heterogeneous integration, leading efforts from early technology path finding through production ramp. You will work closely with foundries, OSATs, substrate suppliers, and internal cross-functional teams to shape both product execution and long-term packaging strategy.

 Key Responsibilities

• Serve as technical authority for IC and SiP packaging across multiple products and programs.
• Own package ar...