Focus on process yield engineering and bump process integration. Collaborate with cross‑functional teams to troubleshoot and resolve process‑related issues observed during the wafer bumping process (both Dry and Wet), including the proposal and execution of Design of Experiments (DOEs)
Responsible to look into data analysis for yield and detect trend
Lead continuous improvement projects & device qualifications using APQP approach
Execute CIP (Continuous Improvement Program) or project handling that contributes yield & cost efficiency improvement
Review and propose updates to calculated Statistical Process Control (SPC) limits to improve product quality and ensure process stability
Take ownership of customer technical inquiries, perform detailed spec reviews, and lead the implementation of requirements for product offload transition from New Product Introduction (NPI) to mass production.