This role plays a key technical leadership position, responsible for process robustness, equipment performance, yield improvement, and technology readiness from development through High Volume Manufacturing (HVM). Experience supporting BIM lines is a strong advantage.

What You Will Do

• Develop, characterize, optimize, and sustain molding processes and equipment for semiconductor backend assembly.
• Own molding process performance, yield, and equipment stability in production.
• Provide technical leadership and guidance on molding-related topics within cross-functional teams.
• Support New Product Introduction (NPI), process qualification, and smooth ramp-up into HVM.
• Drive continuous improvement initiatives to improve yield, quality, reliability, UPH, and cost efficiency.
• Identify molding process integration risks and define mitigation plans using structured engineering methods.
• Troubleshoot and resolve ...