Position Overview
About the Role Micron’s Advanced Packaging Technology Development (APTD) is responsible for delivering package development for high-performance memory products and transfer to manufacturing. We are looking for an Advanced Packaging Integration Engineer to join our APTD team.
Responsibilities - Develop and enable advanced package technology for various post-fab wafer finish and assembly processes.
- Improve product quality, drive yield improvements, reduce costs and enhance productivity.
- Integrate semiconductors while partnering with process and product engineering teams.
- Achieve and improve yields through silicon package integration innovation, including layout/design or process margin improvements.
- Collect and analyze data to provide actionable outcomes and decisions for layout, design, or integration flow changes.
- Work with Probe, Yield Analysis, Test, and Product Engineering teams to drive improvements.
- E...