As part of NSTIC’s Silicon Photonics Department, the candidate will be working on the design of high-speed modulators. You will work closely with an excellent multidisciplinary team involving photonics, semiconductor process, and fab operation to realize next‑generation photonic integrated chips using our industry‑grade fabrication facilities.

• Design of high-speed thin‑film lithium niobate (TFLN) modulators aiming for next‑generation communications systems up to 400 G/lane.
• Perform RF modelling of electrodes including impedance matching, velocity matching and microwave loss.
• Co‑work with EIC driver design and system packaging team to optimize TFLN modulators and packaging parasitics.
• Drive the layout and design rule definition for 8‑inch/12‑inch wafer platforms, ensuring designs are robust for PDK‑level repeatability. Data analysis and documentation.
...