Description

• Lead formulation and optimization of polymer-based thermal interface materials (TIM1, TIM1.5, TIM2) and potting compounds for advanced semiconductor packaging. • Apply structure–property relationships to guide formulation strategy, performance trade-offs, and portfolio evolution. • Design and execute hypothesis-driven experimental programs linking polymer chemistry, fillers, and processing to thermal, mechanical, and reliability performance. • Generate high-quality data to support stage-gate decisions, technical risk assessment, and commercialization Build and evaluate package-level assemblies to assess material performance under realistic thermal, mechanical, and environmental conditions. • Support reliability testing and qualification for high thermal flux and mechanically constrained packaging environments. • Translate material-level results into package- and system-level performance implications. Customer & Market Engagement • Lead customer-facing technical en...