General Summary

Company: Qualcomm India Private Limited

The successful candidate will operate as a member of the Corporate Engineering unit, PWB CAD department, and will provide PWB design solutions for a variety of design types. Examples include Product Test Engineering (PTE) designs such as UFLEX/IFLEX Probe cards, 93K DIB, Bench boards and Daughter Cards, Socketed and Solder‑down, HTOL, with multiple DUT sites up to 32X; Emulator designs with large/high‑density digital circuits containing several FPGAs (>1500 pins) and very high‑speed signals; and Reference handset designs that are ‘form factor accurate’ (FFA). These projects require mastery in digital processors, RF and radio circuits, power control devices, micro‑vias (stacked), sequential lamination stack‑ups and design rules using .5 mm pitch and smaller packages. The role involves collaborating with US and India teams to deliver high‑performance electronic assemblies for Mobile, Modem, and IoT, p...