Position Overview
To contribute in advancing high‑precision semiconductor production by applying technical skills in back‑end assembly test operation.
Perform specific back-end semiconductor manufacturing functions in the production of semiconductor devices Operate various equipment in performing functions such as wafer scribe and break, die sort, die attach, lead bonding and seal, test, or mark and pack Graduate of a 2-year Technical course or Senior High School, or completed at least 2 years in college