As a member of the HIG HBM Package Product Engineering team, you will be part of a high-performing group driving package and HBM product engineering activities within the HBM Systems and Product Engineering Team.

• ASM Yield and DPM Improvement: Accountable for improving assembly related coverage within the manufacturing flows to improve the Time 0 and Field DPM and reduce/prevent inline fallout within the assembly process.
• HBM Cube Yield Improvement: Improving HBM Cube yield through test optimization and coverages by collaboration with Technology Development and Packaging organizations to reduce Manufacturing Line Yield.
• Cumulative Yield Ownership: Work with cross‑functional teams to lead impactful initiatives that significantly enhance overall cumulative yield and quality improvement, driving substantial benefits for the organization.
• Root Cause and Resolution of Qual and RMA Packaging Issues: Debug and identify root...