Process Engineer roles at SiPFAB

System-in-Package Fabrication (SiPFAB) is a new infrastructure being established at the Faculty of Information Technology and Communication Sciences (ITC) of Tampere University. Located on the Hervanta campus, SiPFAB focuses on chip packaging, integration, and testing. The pilot line provides a unique environment for combining and testing Wide Bandgap (WBG) chips and various semiconductor components as complete system solutions.

SiPFAB enables the development and experimentation of future‑oriented, environmentally friendly, and customized packaged chip systems. The infrastructure supports research and pilot‑scale development of emerging chip technologies that drive energy‑efficient solutions for industrial applications in transportation and energy systems. SiPFAB offers research and development services, piloting opportunities, and expert support across all stages of chip integration and packaging for the industry—from concept to...