A leading semiconductor materials provider specializing in high-quality packaging materials, including solder spheres and solder paste, supporting advanced chip packaging and global semiconductor assembly operations.
Job Responsibilities:
Analyse process performance and identify opportunities for continuous improvement.
Support new product introduction (NPI), process qualification and validation activities.
Develop, review and update process parameters, work instructions and standard operating procedures (SOPs).
Conduct root cause analysis and implement corrective and preventive actions (CAPA) for process-related issues.
Collaborate with Production, QA and EHS teams to resolve process abnormalities and improve manufacturing performance.
Equipment Engineering- Manage production equipment installation, commissioning and qualification.