Key Responsibilities Process Setup & NPI (New Product Introduction) Define the complete SMT workflow: solder paste printing → pick & place → reflow → AOI → THT → rework. Partner with customers on DFM (Design for Manufacturing), review Gerber files, stencil designs, and panelization. Create process documentation: work instructions, quality control plans, and Design Failure Mode and Effect Analysis (DFMEA). Hands-On Process Optimization Lead profiles for reflow and wave soldering (e.g., using KIC systems). Optimize printer parameters (squeegee speed, pressure) and pick-and-place feeders to reduce defects (bridging, tombstoning, insufficient solder). Drive continuous improvement using SPI and AOI data; target <1% defect rates. Quality & Yield Management Troubleshoot process-related failures (e.g., head-in-pillow, voiding) using root cause analysis (8D, Fishbone, 5 Whys). Manage a rework process using soldering tools, BGA rework stations. Imple...