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Process Development Engineer (Wire bond Package R&D)

Nexperia
Location 📍 Seremban, Malaysia
Posted 📅 June 01, 2026
Work Type ⏰ Full time

Position Overview

As a Process Development Engineer (WB), you will develop and optimize semiconductor assembly processes to meet project Functional Requirement Specifications (FRS), ensuring robust manufacturability, reliability, and high-quality output for new products and platforms.

What You Will Do

  • Develop and characterize new semiconductor process technologies, applying structured engineering methods such as DOE, SPC, FMEA, and Six Sigma

  • Drive end-to-end process development from concept to stable, high-yield manufacturing solutions

  • Provide technical input for assembly processes and equipment solutions for new products and platforms

  • Lead technical discussions and troubleshooting on wire bond and related FOL processes across project teams and sites

  • Apply wafer metallization knowledge to optimize process performance and stability

  • Conduct benchmarking and technology studies to support package roadmap and...

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    Job Details

    Employment Type
    Full time
    📊
    Category
    Engineers
    🏠
    Work Arrangement
    On-site
    📍
    Location
    Seremban, Malaysia