Job Summary The Principal Process Engineer is a senior technical leader within the Malaysia IL Wafer Process Engineering organization, responsible for providing high‑level, self‑driven project leadership and deep subject matter expertise in post‑Fab wafer processing. This role focuses on wafer backgrind, thinning, and metallization processes critical to successful die assembly, test, and long‑term product reliability. The incumbent leverages strong technical depth, data‑driven methodologies, and emerging AI‑enabled analytics to optimize manufacturing performance, influence executive‑level decisions, and drive continuous improvement across the end‑to‑end semiconductor manufacturing flow.

Key Responsibilities:

Serve as the principal technical expert for wafer backgrind, thinning, and metallization processes in preparation for die assembly and final test.

Provide deep technical guidance across wafer fabrication, back‑end assembly and packaging, final electrical ...