Work with IC design and test teams to create and review test plans, including providing recommendations for DFT & DFQ, test & debug visibility, manufacturability plan etc
Bench-level testing, characterization, and debug of full ICs and IC sub-systems
Work with manufacturing and process engineering team to develop, characterize new assembly processes
360deg characterization: ensure test coverage and cross-domain-correlations
ATE to bench correlation and establishment of ATE production test limits
Prepare wafer-split plan for process window characterization/DOE
Limit and guard band definition for all test-program versions