Develops and leads SiP (System in Package) assembly and IC packaging material and processes to meet quality, reliability, cost, yield, productivity and manufacturing requirements.
Leads new package and SMT/Flip Chip/Underfill process qualification programs.
Develops and maintain process documentation, including standard operating procedures and work instructions.
Plans and conducts experiments to fully characterize material and processes throughout pathfinding to development to ramp.
Develops solutions to improve quality, reliability, cost, yield, process stability/capability, productivity utilizing statistical knowledge, and problem‑solving tools.
Establishes process control systems. Transfers process to high volume manufacturing and provide support in new factory start‑up.