Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

As a Bonding Process & Equipment Engineer at Micron Technology, you will be part of the Micron Central team under ADT, responsible for the startup, development, optimization, and control of wafer‑level bonding processes (e.g., hybrid bonding, fusion bonding, temporary bonding).

• Develop, qualify, and optimize bonding process technologies (e.g., hybrid bonding, dielectric bonding, TSV‑related integration)
• Establish, refine and simplify process conditions, recipes, and operating windows to meet performance and reliability targets
• Drive process capability improvement (Cpk) and defect reduction

• Lead yield enha...