+ New package technology and platform module development (Si-gel filled module).
+ Technical leadership on new power module technology and enabling technology for automotive/industrial application.
+ Technical interface for package team, communication with business unit, marketing, device TD, quality/reliability, manufacturing and application team.
+ Package/design review for new package development, on-tme release with the first pass success (qualification).
+ Present technical finding, design review and recommendation to stakeholders and management.
+ Lead package related failure analysis, reliability testing and debug package issues.
+ Participate in customer meeting, provide technical clarification and support failure investigation.

**onsemi** (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification ...