NVIDIA is now looking for a hardworking student to join our Advanced Research Group. Low-power interconnects are crucial for data centers and AI factories. The integration of

(PICs) with electronic integrated circuits (EICs)—known as Co-Packaged Optics (CPO)—has become essential for achieving this goal. Today, CPO technologies are deployed at the networking level (scale-out), and they hold great potential to transform chip-to-chip communication (scale-up).

A key enabler for this vision is the development of new laser sources, such as optical frequency comb lasers, which can generate multiple wavelengths for DWDM links.

At NVIDIA’s Advanced Research Group, we are developing, designing, and characterizing comb lasers to make this technology a reality. This position offers a unique opportunity to contribute to cutting-edge research with real impact on the future of AI infrastructure and data-center interconnects.


What you’ll be doing:

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