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Packaging Module Development Engineer

Intel
Location 📍 Phoenix, United States
Posted 📅 June 11, 2026
Work Type ⏰ Full-time

Position Overview

**Job Details:**

**Job Description:**

+ Develops assembly processes and/or equipment and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies.
+ Optimizes and improves the efficiency of manufacturing of packages, developing processes to meet quality, reliability, cost, yield, productivity and manufacturability requirements.
+ Develops process and equipment specifications applying principles for design of experiments and data analysis, and documents improvements through white papers.
+ Develops and maintains equipment to evaluate silicon and package technologies under simulated field use conditions, such as heat, humidity, temperature cycle, and dynamic forces.
+ Ensures manufacturability of physical layout of package design and oversees the cycle of manufactured package processes, procedures and flows.
+ Establishes material specifications for contract assemblers and raw material ve...

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Job Details

Employment Type
Full-time
📊
Category
other-general
🏠
Work Arrangement
On-site
📍
Location
Phoenix, United States