Participate in the development of package design and advanced substrate layout for products.
Learn and become proficient in EDA layout tools (e.g., Cadence SIP/Allegro) to perform package and substrate drawing, design modifications, and related engineering tasks.
Perform basic routing planning, layer stack‑up configuration, and design‑for‑manufacturability (DFM) checks based on established design rules and manufacturing requirements.
Collaborate with cross‑functional engineering teams—including hardware, manufacturing, and packaging—to support package structure evaluations, design updates, and issue resolution.
Qualifications
Required Qualifications:
Bachelor’s or Master’s degree in Electrical Engineering, Electronics Engineering, Materials Science, Mechanical Engineering, Physics, or other related engineering/science fields.