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Packaging Engineer - Inductor and Power Module

Texas Instruments
Location 📍 Taiwan, Taiwan
Posted 📅 May 26, 2026
Work Type ⏰ Full-time

Position Overview

The Emerging Packaging and Test Team at Texas Instruments is looking for a Magnetics and Passives Integration Technologist

+ Lead the definition, development and realization of comprehensive low-profile inductors, planar magnetics, and integrated passives roadmaps to enable ultra-compact, high-density, high current (100-300A) power delivery modules for enterprise and AI infrastructure
+ Develop strategic relationships and partnerships with leading suppliers worldwide to co-develop magnetic materials, inductors, capacitors, and packaging technologies that meet performance, reliability, and scaling needs.
+ Ensure manufacturability, testability and reliability through early-stage DfX, material qualification, and close supplier collaboration.

The candidate must be a proven leader, capable of working collaboratively across worldwide cross functional teams and accelerating development cycles to meet aggressive time-to market targets.

**Why TI?**

+ E...

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Job Details

Employment Type
Full-time
📊
Category
other-general
🏠
Work Arrangement
On-site
📍
Location
Taiwan, Taiwan